Lucintel’s latest market report analyzed that semiconductor bonding material provides attractive opportunities in the RF device, CMOS image sensor, LED, 3D NAND, and MEMS & sensor applications. The semiconductor bonding material market is expected to reach $0.90 billion by 2028 with a CAGR of 8%. In this market, wafer bonder is the largest segment by product type, whereas LED is largest by application.
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Based on product type, the semiconductor bonding material market is segmented into die bonder, wafer bonder, and flip chip bonde. The wafer bonder segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to increasing application in manufacturing ICs, microsystems, nanoelectronics, and other micromechanical systems.
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The Semiconductor Bonding Material Market is marked by the presence of several big and small players. Some of the prominent players offering semiconductor bonding material include ASM Pacific, BE Semiconductor, Panasonic, Fasford, Shinkawa, and EV Group.
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