Copper Clad Laminate Market size is predicted to reach $18 billion by 2030, growing at a CAGR of 5.4% during the forecast period 2023-2030 according to the latest market research report published by IndustryARC. Growing need for wire boards and semiconductor chips in a number of electronic devices, technical changes in the automotive industry are propelling the Copper Clad Laminate Market growth, finds IndustryARC in its recent report, titled “Copper Clad Laminate Market Size, Share & Trends Analysis Report By Form (Rigid Sheets, Flexible Sheets), By Reinforcement Material (Glass Fiber, Paper Base, Compound Materials, Others), By Resin Type (Epoxy, Phenolic, Polyimide, Others), By Substrate (Organic, Inorganic), By Copper Foil (Standard, HTE, LP) (By Application (Television, Mobiles, Computers, Radars, Defense Equipment), By End-Use Industry (Communication Systems, Computers, Consumer Applications, Automotive, Healthcare, Aerospace & Defense, Others), By Geography – Global Opportunity Analysis & Industry Forecast, 2023–2030
Request Sample Research Report: https://www.industryarc.com/pdfdownload.php?id=19894
Asia-Pacific to Register the Highest Growth:
The Copper Clad Laminate industry in this region is expanding due to the need for copper clad laminates is rising across a range of industries, including computers, communication systems, consumer electronics, automotive electronics, medical equipment, and defense technology.
Moreover, the significant investments by the government and private manufacturers in 5G infrastructure development and the technological shift in the automotive sector are the major factors propelling the market growth in this region. For instance, AGC Ceramics created a joint venture in China for the BRIGHTORBTM 3D printer business in October 2022. These factors are all due to the expansion of the electronics and automotive industries.
Copper Clad Laminate Market 2023-2030: Scope of the report
Report Metric |
Details |
Base Year Considered |
2022 |
Forecast Period |
2023–2030 |
CAGR |
5.4% |
Market Size in 2030 |
$18 billion |
Segments Covered |
Form, Reinforcement Material, Resin Type, Substrate, Copper Foil, Application, End Use Industry, Geography |
Geographies Covered |
North America (U.S., Canada and Mexico), Europe (Germany, France, UK, Italy, Spain, Russia and Rest of Europe), Asia-Pacific (China, Japan, South Korea, India, Australia, New Zealand and Rest of Asia-Pacific), South America (Brazil, Argentina, Chile, Colombia and Rest of South America), Rest of the World (Middle East and Africa). |
Key Market Players |
NAN YA Plastics Corporation Taiwan Union Technology Corporation Panasonic Corporation ITEQ Corporation Sytech Technology Cipel Italia Grace Electron Union Technology Corporation Kingboard Laminates Holdings Ltd. Shengyi Technology Co. Ltd. |
Get Access to Full Research Report: https://www.industryarc.com/Report/19894/copper-clad-laminates-market.html
Copper Clad Laminate Market Report – Key Takeaways:
Growth in 5G infrastructure to Boost Market Demand
Copper Clad Laminates are utilized in PCB circuits of the highest thickness to enhance durability and signal transmission and the usage of copper-clad laminates in the 5G infrastructure increases demand for the product since they enhance signal transmission, avoid delamination, manage heat, reduce weight, regulate moisture, and are more cost-effective.
Phenolic to Register Highest Growth in Resin Type
According to the Copper Clad Laminate Market forecast, phenolic is the fastest-growing resin type having a CAGR of 6.5% during 2023 – 2030. Phenolic is used to make Alkali free E-glass fabric and phenolic panels are resistant to weather and sun and because it is closed pore, it does not attract dirt. Cleaning is easy and inexpensive.
Purchase this Premium Report:
https://www.industryarc.com/purchasereport.php?id=19894
Key Opportunity Analysis:
High Demand for PCBs with More Thickness is Creating Growth Opportunities:
In March 2022, Taiwan Union Technology Corporation (TUC) collaborated with IEC to provide the best quality to the PCB sector. Many end-use sectors are experiencing an increase in PCB demand. The use of PCBs, which are made of a copper sheet bonded with a non-conductive substrate, allows for the connection of electronic components via signal traces, tracks, and conductive paths. Connectors, diodes, resistors, capacitors, and other radio components are some of the electronic parts that are put together on PCBs and are interconnected all across the board.
Technological Shift in the Automotive Sector is Creating Growth Opportunities:
The increasing electrical and electronic sectors in developing countries are having an impact on the expansion of the global market for copper-clad laminates. The car industry makes substantial use of copper clad in electronic assembly technology. Most automakers have been creating new models with the addition of numerous technical features due to fluctuating consumer expectations, rapid urbanization and rapid technological improvements. Additionally, the significant investments by the government and private manufacturers in 5G infrastructure development and the technological shift in the automotive sector are creating substantial growth opportunities for the Copper Clad Laminate Market. In 2022, Panasonic developed Multi-Layer Circuit Board Materials (MEGTRON 8), reducing power consumption by lowering the tension loss and contributing to the larger capability and high high-speed communication.
If you have any questions, please feel free to contact our experts at: https://www.industryarc.com/reports/request-quote?id=19894
The Report also Covers the Following Areas:
Copper Clad Laminate Market Size and Forecast
Copper Clad Laminate Market Trends
Copper Clad Laminate Market Analysis by Product Type
Copper Clad Laminate Market 2023-2030: Key Highlights
CAGR of the market during the forecast period 2023-2030
Value Chain Analysis of key stake holders
Detailed Analysis of market drivers and opportunities during the forecast period
Copper Clad Laminate Market size estimation and forecast
Analysis and predictions on end users’ behavior and upcoming trends
Competitive landscape and Vendor market analysis including offerings, developments, and financials
Comprehensive Analysis of challenges and constraints in the Copper Clad Laminate Market
Covid and Ukrainian Crisis Impact:
Due to the global economic crisis caused by Covid-19, The demand for copper clad laminates has fallen as a result of a decline in the demand for electrical and electronic devices, the market was severely hit by the global trade restrictions that prevented imports and exports and there is a shortage of raw materials, the rise in instrument and equipment prices.
Because of the ongoing confrontation between Russia and Ukraine, commodity prices are rising. Asia was the world’s largest producer of goods, and its trade with Europe is currently complicated. The expansion of the Copper Clad Laminate Market has been hampered by the Russia-Ukraine war’s disruption of the supply chain. Due to the disturbance, there are now more expensive freight rates, fewer available containers, and less warehouse space. As a result, the aftermarket is experiencing inflationary problems.
To Get a Customized Industry Analysis, Speak with our Research Analyst: https://connect.industryarc.com/lite/schedule-a-call-with-our-sales-expert
List of Key Market Players in Copper Clad Laminate Market:
The Global Copper Clad Laminate Market is fragmented with several global and regional companies operating with expansive manufacturing capabilities and extensive distribution networks. The key companies profiled are listed below:
NAN YA Plastics Corporation (NAN YA)
Taiwan Union Technology Corporation (tuc)
Panasonic Corporation (MEGTRON-6)
ITEQ Corporation
Sytech Technology
Cipel Italia
Grace Electron
Union Technology Corporation
Kingboard Laminates Holdings Ltd.
Shengyi Technology Co. Ltd.
Related Reports:
Flexible Copper Clad Laminate Market – Flexible Copper Clad Laminates Market size is forecasted to grow at a CAGR of 5.7% during 2022-2027. Flexible CCL is a single-layer or double-layer flexible copper clad laminate made of insulating PI film or polyester film as the substrate material and a thin copper foil conductor with surface flexibility.
High-End Copper Foil Market – High-End Copper Foil Market size is forecasted to grow at a CAGR of 6.5% during 2020-2025, owing to its growing applications as a printed circuit board (PCB) material. The increase in the demand for advanced consumer electronics and smart devices, growing automation in industries, and technologically advanced healthcare devices are driving PCB demand which in turn drives high-end copper foils market growth.
Decorative Laminates Market – The Decorative Laminates Market size is estimated to grow at a CAGR of around 3.7% from 2022 to 2027. Decorative laminates are materials used for lamination with decorative papers on various surface materials to be used in walls, floors and furniture to give an aesthetic appeal to the interior designing of homes and offices.
Europe Copper Tubes Market – Europe Copper Tubes Market size is forecast to grow at a CAGR of 3.2% during 2021-2026. Copper tubes are extensively used in the construction and electrical industries due to their conductive properties. They are cost-effective and degrade the possibilities of contamination caused by oxygen, ultraviolet (UV) rays and high temperature and that’s the reason it is mostly preferred in industrial heat exchange, plumbing and other application.
About IndustryARC™:
IndustryARC primarily focuses on Market Research and Consulting Services specific to Cutting Edge Technologies and Newer Application segments of the market. The company’s Custom Research Services are designed to provide insights into the constant flux in the global demand-supply gap of markets.
IndustryARC’s goal is to provide the right information required by the stakeholder at the right point in time, in a format that assists an intelligent and informed decision-making process.
Contact Us:
Mr. Venkat Reddy
IndustryARC
Email: [email protected]
USA: (+1) 518-282-4727
Web: https://www.industryarc.com
Follow us on: LinkedIn | Facebook | Twitter
Contact Information:
Contact Us: Mr. Venkat Reddy IndustryARC Email: [email protected] USA: (+1) 518-282-4727
Tags:
iCN Internal Distribution, Extended Distribution, Wire, BNN, Research Newswire, English